Manufacturing Capabilities

Rigid PCB Manufacture capability

Item Manufacture capability
 Mass production Sample
Max. dimension 622*546mm(24.5”*21.5”) 622*546mm(24.5”*21.5”)
 Copper thickness of inner layer 1/2~5oz 1/2~6oz
 Copper thickness of outer layer 1/3~6oz 1/3~8oz
 Min. Annular ring 3mil 2mil
 Min. solder mask bridge 3mil 2mil
 Min. solder mask clearance 1.5mil 1mil
 Impedance tolerance +/-10% +/-8%
 Finished board thickness 0.25mm-3.5mm 0.2mm-4.0mm
 Outline precision +/-0.1mm +/-0.08mm
 Surface finished type HASL(LF)Flash goldENIGOSP(Lead free compatible)Carbon inkPeelable S/MImmersion Ag/TinGold finger platingENIG+ Gold finger platingImmersion Ag+ Gold finger plating  HASL(LF)Flash goldENIGOSP(Lead free compatible)Carbon inkPeelable S/MImmersion Ag/TinGold finger platingENIG+ Gold finger platingImmersion Ag/Tin+Gold finger platingENIG+OSP
Surface treatment thickness HASL:  0.76-38um

Flash gold:  0.01-0.076um(Au)

ENIG:  0.025-0.20um(Au)

Gold finger:  0.127-1.27um(Au)

Immersion Tin:  0.8um min

Immersion silver:  0.15-0.30um

OSP:  0.15-0.60um

HASL:  0.76-38um

Flash gold:  0.01-0.076um(Au)

ENIG:  0.025-0.30um(Au)

Gold finger:  0.127-1.27um(Au)

Immersion Tin:  0.8um min

Immersion silver:  0.15-0.30um

OSP:  0.15-0.60um

Production type High precision multi-layer boardBlind hole boardBuried hole boardHigh frequency boardAluminum backed board High precision multi-layer boardBlind hole boardBuried hole boardHigh frequency boardAluminum base boardCopper base boardCeramic boardHDI
 Base material FR-4Aluminum/Cu base board Halogen-free lead free compatible High TG high CTI CEM-1 CEM-3 Rogers 、Teflon FR-4 Aluminum/Cu base board Halogen-free lead free compatible High TG high CTI CEM-1 CEM-3copper base Ceramic base
 Layers  1-16 layer  1-20 layers
 Inner layer circuit(W/S) 3/3mil 2/2mil
 Outer layer(W/S) 3/3mil 2/2mil
 Inner layer board thickness 0.1-1.6mm 0.075mm-1.6mm
 Min.drill bit hole size 0.2mm 0.2mm
 Hole plating aspect ratio (max) 81 101
Thermal shock test 288℃,10S, 3X 288℃,10S, 3X
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