22 Layers Neclo 3M Embedded Capacitance PCB

Nelco Material

ENIG

22 Layers

3M Embedded Capacitance PCB

Black Solder Mask

UL, ISO9001, ISO14001, IATF 16949, ROHS Certificated

  • Description
  • Inquiry

Quick Details

Place of Origin: Guangdong, China (Mainland)
Brand Name: ShenZhen DiHe
Model Number:SZDH-Multilayer PCB-020
Base Material: FR-4
Copper Thickness: 1oz
Board Thickness: 2.0mm
Min. Hole Size: 1.0mm
Surface Finishing: ENIG
Wrap and twist:: ≤0.75%
Standard:: IPC-A-6012
Service type: Neclo 3M Embedded Capacitance PCB manufacturing

Packaging & Delivery

Packaging Details: vacuum package with high quality carton box
Delivery Detail: 20-30 days
Specifications

  1. Competitive Price, fast reply for RFQ
  2. UL, ISO9001, ISO14001, IATF 16949, ROHS Certificated
  3. High Quality, 100% E-Testing OR Flying Probe Testing

Welcome To ShenZhen DiHe

ShenZhen DiHe, your best option for pcb manufacturing, components source and one-stop pcb assembly.

Product Description

  1. Printed Circuit Board Manufacturing Capability:

 

Item Manufacture capability
 Mass production Sample
Max. dimension 1200*546mm(47.25”*21.5”) 1500*546mm(59”*21.5”)
 Copper thickness of inner layer 1/2~5oz 1/2~6oz
 Copper thickness of outer layer 1/3~8oz 1/3~10oz
 Min. Annular ring 3mil 2mil
 Min. solder mask bridge 3mil 2mil
 Min. solder mask clearance 1.5mil 1mil
 Impedance tolerance +/-10% +/-8%
 Finished board thickness 0.25mm-3.5mm 0.2mm-4.0mm
 Outline precision +/-0.1mm +/-0.05mm
 Surface finished type HASL(LF)Flash goldENIGOSP(Lead free compatible)Carbon inkPeelable S/MImmersion Ag/TinGold finger platingENIG+ Gold finger platingImmersion Ag+ Gold finger plating  HASL(LF)Flash goldENIGOSP(Lead free compatible)Carbon inkPeelable S/MImmersion Ag/TinGold finger platingENIG+ Gold finger platingImmersion Ag/Tin+Gold finger platingENIG+OSP
Surface treatment thickness HASL:  0.76-38um

Flash gold:  0.01-0.076um(Au)

ENIG:  0.025-0.20um(Au)

Gold finger:  0.127-1.27um(Au)

Immersion Tin:  0.8um min

Immersion silver:  0.15-0.30um

OSP:  0.15-0.60um

HASL:  0.76-38um

Flash gold:  0.01-0.076um(Au)

ENIG:  0.025-0.30um(Au)

Gold finger:  0.127-1.27um(Au)

Immersion Tin:  0.8um min

Immersion silver:  0.15-0.30um

OSP:  0.15-0.60um

Production type High precision multi-layer boardBlind hole boardBuried hole boardHigh frequency boardAluminum backed board High precision multi-layer boardBlind hole boardBuried hole boardHigh frequency boardAluminum base boardCopper base boardCeramic boardHDI
 Base material FR-4Aluminum/Cu base board Halogen-free lead free compatible High TG high CTI CEM-1CEM-3 Rogers  Teflon  Nelco  Arlon  Taconic FR-4 Aluminum/Cu base board Halogen-free lead free compatible High TG high CTI CEM-1 CEM-3copper base Ceramic base Rogers  Teflon  Nelco  Arlon  Taconic
 Layers  1-24 layer  1-40 layers
 Inner layer circuit(W/S) 3/3mil 2/2mil
 Outer layer(W/S) 3/3mil 2/2mil
 Inner layer board thickness 0.1-2.0mm 0.075mm-2.0mm
 Min.drill bit hole size 0.2mm 0.2mm
 Hole plating aspect ratio (max) 81 121
Thermal shock test 288℃,10S, 3X 288℃,10S, 3X

 


♦ All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please contact us.

2. Lead time

Samples: Within 24 hours with expedite cost
Mass production: Short delivery time according to different pcb order.

3. Payment Terms:

T/T, WEST UNION, Paypal Accepted
4. View of DiHe Factory
pcb factory
5. Our Advantage:

***Free samples available

***Prompt response
prompt response for RFQs and order status checking.

***Reliable Quality
Complying with IPC class 2 standards. 100% electrical tested.

***Attractive Price
Minimize costs during production and charge low from customers.

***On time Delivery
On time delivery rate is over 97%

***Quick Lead time
2-6 days for one layer, 3-9days for 2 layers, 4-13days for 4 layers, 5-16 days for 6 layers.

***Various Solution
Whatever kind of PCB you’re looking for, we can find a satisfactory solution for you.






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