3 layers immersion gold mcpcb manufacturing for high power led

3 layers immersion gold mcpcb manufacturing for high power led

3 layers immersion gold aluminum mcpcb

Product No: SZDH-MCPCB-001 Categories: ,
  • Description
  • Inquiry

Quick Details

Place of Origin: Guangdong, China (Mainland)
Brand Name: ShenZhen DiHe
Model Number: SZDH-Alu pcb-002
Base Material: Aluminum base
Copper Thickness: 1oz
Board Thickness: 2.0mm
Min. Hole Size: 1.0mm
Surface Finishing: immersion gold
Wrap and twist:: ≤0.75%
Standard:: IPC-A-6012
Service type: printed circuit board manufacturing

Packaging & Delivery

Packaging Details: vacuum package with high quality carton box
Delivery Detail: 30-40 days for multilayer aluminum pcb
Specifications

  1. Competitive Price, fast reply for RFQ
  2. UL, ISO9001, ISO14001, IATF 16949, ROHS Certificated (Please go to “About Us” section see the certificate.)
  3. High Quality, 100% E-Testing OR Flying Probe Testing

Welcome To ShenZhen DiHe

ShenZhen DiHe, your best option for pcb manufacturing, components source and one-stop pcb assembly.

Product Description

  1. Printed Circuit Board Manufacturing Capability:
Item Manufacturing Capability
 Mass production Sample
Max. Dimension 1 Layer: 2000*1200MM(78.7*47.2″)

2 Layers: 2000*900MM(78.7*35.4″)

4-16 Layers: 1650*750MM(64.9*29.5″)

 Copper Thickness of Inner Layer 1/2~5oz 1/2~6oz
 Copper Thickness of Outer Layer 1/3~8oz 1/3~10oz
 Min. Annular Ring 3mil 2mil
 Min. Solder Mask Bridge 3mil 2mil
 Min. Solder Mask Clearance 1.5mil 1mil
 Impedance Tolerance +/-10% +/-8%
 Finished Board Thickness 0.25mm-3.5mm 0.2mm-4.0mm
 Outline Precision +/-0.1mm +/-0.05mm
 Surface Finished Type HASL(LF), Flash gold, ENIG, OSP(Lead free compatible), Carbon ink, Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger plating, Immersion Ag+ Gold finger plating  HASL(LF), Flash gold, ENIG, OSP(Lead free compatible), Carbon ink, Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger plating, Immersion Ag/Tin+Gold finger plating, ENIG+OSP
Production Type High Precision Multi-layer Circuit Board, Blind Vias Board, Buried Vias Board, High Frequency Board, Aluminum Backed Board, High Speed PCB, Embedded Capacitance PCB, Halogen-Free Circuit Board, High-Conductivity Aluminum-Based, Copper-Based and Metal-Mixed PCB,
Ceramic Based Circuit Board, Ultra-Thin BT board, Thick Copper Circuit Board, Thick Gold PCB, HDI, FPC, Rigid-Flex PCB, Teflon (PTFE),
High-Frequency Mixing Plates Circuit Board
High Precision Multi-layer Circuit Board, Blind Vias Board, Buried Vias Board, High Frequency Board, Aluminum Backed Board, High Speed PCB, Embedded Capacitance PCB, Halogen-Free Circuit Board, High-Conductivity Aluminum-Based, Copper-Based and Metal-Mixed PCB,
Ceramic Based Circuit Board, Ultra-Thin BT board, Thick Copper Circuit Board, Thick Gold PCB, HDI, FPC, Rigid-Flex PCB, Teflon (PTFE),
High-Frequency Mixing Plates Circuit Board
 Base Material FR-4, Aluminum/Cu base board, Halogen-free , High TG, High CTI, High Thermal Conductivity, CEM-1, CEM-3, Rogers, Teflon,  Nelco, Arlon, Taconic,

PANASONIC MEGTRON 6

 

FR-4, Aluminum/Cu base board, Halogen-free, High TG, High CTI, High Thermal Conductivity, CEM-1,  CEM-3, Copper Base, Ceramic Base,  Rogers, Teflon,  Nelco,  Arlon, Taconic, PANASONIC MEGTRON 6
 Layers  1-24 layer  1-40 layers
 Inner Layer Circuit(W/S) 3/3mil 2/2mil
 Outer Layer(W/S) 3/3mil 2/2mil
 Inner Layer Loard Lhickness 0.1-2.0mm 0.075mm-2.0mm
 Min. Drill Bit Hole Size 0.2mm 0.2mm
Min. Laser Vias Size 0.1mm 0.1mm
 Hole Plating Aspect Ratio (Max) 8:1 12:1

 

No.  Item  Alu Material Specification
1  Insulation thickness  100-150um
2  Break-down voltage  AC 3.5 OR 6.0KV
3  Withstand voltage  DC 3.0 OR 4.0KV
4  Flammability  t1: 0, t2: 0
5  Glass Transition Temperature  130 ℃
6  Dielectric Constant  1MHZ: 5.2
7  Thermal Stress  288℃>120S
8  Heat Resistance  0.6-0.8℃/W
9  CTI  >600V
10  Thermal Conductivity  1.3, 1.6, 2.0, 3.2W/m.k

 

♦ All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please contact us.

2. Lead time

Samples: Within 24 hours with expedite cost
Mass production: Short delivery time according to different pcb order.

3. Payment Terms:

T/T, WEST UNION, Paypal Accepted
4. View of DiHe Factory


5. Our Advantage:

***Free samples available

***Prompt response
prompt response for RFQs and order status checking.

***Reliable Quality
Complying with IPC class 2 standards. 100% electrical tested.

***Attractive Price
Minimize costs during production and charge low from customers.

***On time Delivery
On time delivery rate is over 97%

***Quick Lead time
2-6 days for one layer, 3-9days for 2 layers, 4-13days for 4 layers, 5-16 days for 6 layers.

***Various Solution
Whatever kind of PCB you’re looking for, we can find a satisfactory solution for you.






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