Manufacturing Capabilities

 DiHe Rigid PCB Manufacturing Capability

 

Item

Manufacturing Capability

 Mass production Sample
 Layers

 1-48 layers

Max. Dimension

1 Layer: 2000*1200MM(78.7*47.2″)

2 Layers: 2000*900MM(78.7*35.4″)

4-16 Layers: 1650*750MM(64.9*29.5″)

Min. Dimension

2*2mm

 Finished Board Thickness

0.075mm-14mm

 Copper Thickness of Inner Layer

1/2~12oz

 Copper Thickness of Outer Layer

1/3~28oz

 Inner Layer Circuit(W/S)

3/3mil

2/2mil

 Outer Layer(W/S)

3/3mil

2/2mil

 Min. Annular Ring

3mil

2mil

 Min. Solder Mask Bridge

3mil

2mil

 Min. Solder Mask Clearance

1.5mil

1mil

 Impedance Tolerance

+/-10%

+/-8%

 Outline Precision

+/-0.1mm

+/-0.05mm

 Surface Finished Type

HASL(LF), Flash gold, ENIG, OSP(Lead free compatible), Carbon ink, Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger plating, Immersion Ag+ Gold finger plating

 HASL(LF), Flash gold, ENIG, OSP(Lead free compatible), Carbon ink, Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger plating, Immersion Ag/Tin+Gold finger plating, ENIG+OSP

Production Type

High Precision Multi-layer Circuit Board, Blind Vias Board, Buried Vias Board, High Frequency Board, Aluminum Backed Board, High Speed PCB, Embedded Capacitance PCB, Halogen-Free Circuit Board, High-Conductivity Aluminum-Based, Copper-Based and Metal-Mixed PCB,
Ceramic Based Circuit Board, Ultra-Thin BT board, Thick Copper Circuit Board, Thick Gold PCB, HDI, FPC, Rigid-Flex PCB, Teflon (PTFE),
High-Frequency Mixing Plates Circuit Board

High Precision Multi-layer Circuit Board, Blind Vias Board, Buried Vias Board, High Frequency Board, Aluminum Backed Board, High Speed PCB, Embedded Capacitance PCB, Halogen-Free Circuit Board, High-Conductivity Aluminum-Based, Copper-Based and Metal-Mixed PCB,
Ceramic Based Circuit Board, Ultra-Thin BT board, Thick Copper Circuit Board, Thick Gold PCB, HDI, FPC, Rigid-Flex PCB, Teflon (PTFE),
High-Frequency Mixing Plates Circuit Board

 Base Material

FR-4, Aluminum/Cu base board, Halogen-free , High TG, High CTI, High Thermal Conductivity, CEM-1, CEM-3, Rogers, Teflon,  Nelco, Arlon, Taconic,

PANASONIC MEGTRON 6

 

FR-4, Aluminum/Cu base board, Halogen-free, High TG, High CTI, High Thermal Conductivity, CEM-1,  CEM-3, Copper Base, Ceramic Base,  Rogers, Teflon,  Nelco,  Arlon, Taconic, PANASONIC MEGTRON 6

 Min. Drill Bit Hole Size

0.2mm

0.2mm

Min. Laser Vias Size

0.1mm

0.1mm

 Hole Plating Aspect Ratio (Max)

8:1

12:1