Cut Lamination →Drilling Holes→Grinding Plate→Plated Through Hole→
Developing→Line Exposure→Dry Film Lamination→Grinding Plate→Horizontal
Electrolytic Plating→Etching→Solder Mask Printing→Solder Mask Exposure→
Solder Mask Develop→Printing of Legend→Hot Air Solder Leveling→Cleaning&
Baking→Form→V-CUT/ V-scoring→Electrical Testing→FQC→Packing→Shipping
