3.0mm black copper core circuit board

countersink power pcb
Green solder mask aluminum base printed circuit board
METAL-CORE-PCBs-01
002-copper-core-pcb
METAL-CORE-PCBs-01
002-copper-core-pcb

3.0mm black copper core circuit board

single layer copper core聽circuit board

Product No: SZDH-MCPCB-006 Categories: , Tags: , , , ,
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Quick Details

Place of Origin: Guangdong, China (Mainland)
Brand Name: ShenZhen DiHe
Model Number:SZDH-MCPCB-006
Base Material:聽copper core
Copper Thickness: 1oz
Board Thickness: 3.0mm
Min. Hole Size: 1.0mm
Surface Finishing:聽OSP
Wrap and twist:: 鈮0.75%
Standard:: IPC-A-6012
Service type: printed circuit board manufacturing

Packaging & Delivery

Packaging Details: vacuum package with high quality carton box
Delivery Detail: 5-7days
Specifications

  1. Competitive Price, fast reply for RFQ
  2. UL, ISO9001, ISO14001, IATF 16949, ROHS Certificated (Please go to “About Us” section see the certificate.)
  3. High Quality, 100% E-Testing OR Flying Probe Testing (100% Function Test Service )

Welcome To ShenZhen DiHe

ShenZhen DiHe, your best option for pcb manufacturing, components source and one-stop pcb assembly.

Product Description

  1. Printed Circuit Board Manufacturing Capability:
Item Manufacturing聽Capability
聽Mass production Sample
Max.聽Dimension 1聽Layer: 2000*1200MM(78.7*47.2″)

2 Layers: 2000*900MM(78.7*35.4″)

4-16 Layers: 1650*750MM(64.9*29.5″)
聽Copper Thickness of Inner Layer 1/2~5oz 1/2~6oz
聽Copper Thickness of Outer聽Layer 1/3~8oz 1/3~10oz
聽Min. Annular Ring 3mil 2mil
聽Min. Solder Mask Bridge 3mil 2mil
聽Min. Solder Mask Clearance 1.5mil 1mil
聽Impedance Tolerance +/-10% +/-8%
聽Finished Board Thickness 0.25mm-3.5mm 0.2mm-4.0mm
聽Outline Precision +/-0.1mm +/-0.05mm
聽Surface Finished Type HASL(LF),聽Flash gold,聽ENIG,聽OSP(Lead free compatible),聽Carbon ink,聽Peelable S/M,聽Immersion Ag/Tin,聽Gold finger plating,聽ENIG+ Gold finger plating,聽Immersion Ag+ Gold finger plating 聽HASL(LF),聽Flash gold,聽ENIG,聽OSP(Lead free compatible),聽Carbon ink,聽Peelable S/M,聽Immersion Ag/Tin,聽Gold finger plating,聽ENIG+ Gold finger plating,聽Immersion Ag/Tin+Gold finger plating,聽ENIG+OSP
Production Type High Precision Multi-layer Circuit Board,聽Blind Vias Board,聽Buried Vias Board,聽High Frequency Board,聽Aluminum Backed Board, High Speed PCB, Embedded Capacitance PCB, Halogen-Free Circuit Board, High-Conductivity Aluminum-Based, Copper-Based and Metal-Mixed PCB,
Ceramic Based Circuit Board, Ultra-Thin BT board, Thick Copper Circuit Board, Thick Gold PCB, HDI, FPC, Rigid-Flex PCB, Teflon (PTFE),
High-Frequency Mixing Plates聽Circuit Board		 High Precision Multi-layer Circuit Board,聽Blind Vias Board,聽Buried Vias Board,聽High Frequency Board,聽Aluminum Backed Board, High Speed PCB, Embedded Capacitance PCB, Halogen-Free Circuit Board, High-Conductivity Aluminum-Based, Copper-Based and Metal-Mixed PCB,
Ceramic Based Circuit Board, Ultra-Thin BT board, Thick Copper Circuit Board, Thick Gold PCB, HDI, FPC, Rigid-Flex PCB, Teflon (PTFE),
High-Frequency Mixing Plates聽Circuit Board
聽Base Material FR-4,聽Aluminum/Cu聽base board,聽Halogen-free聽,聽High TG,聽High CTI, High Thermal Conductivity,聽CEM-1,聽CEM-3,聽Rogers,聽Teflon,聽聽Nelco,聽Arlon,聽Taconic,

PANASONIC MEGTRON 6

聽

 FR-4,聽Aluminum/Cu聽base board,聽Halogen-free,聽High TG,聽High CTI,聽High Thermal Conductivity,聽CEM-1,聽聽CEM-3,聽Copper Base,聽Ceramic Base,聽聽Rogers,聽Teflon,聽聽Nelco,聽聽Arlon,聽Taconic,聽PANASONIC MEGTRON 6
聽Layers 聽1-24聽layer 聽1-40 layers
聽Inner Layer Circuit(W/S) 3/3mil 2/2mil
聽Outer Layer(W/S) 3/3mil 2/2mil
聽Inner Layer Loard Lhickness 0.1-2.0mm 0.075mm-2.0mm
聽Min.聽Drill Bit Hole Size 0.2mm 0.2mm
Min. Laser Vias Size 0.1mm 0.1mm
聽Hole Plating Aspect Ratio (Max) 8锛1 12锛1

 

No. 聽Item 聽Alu Material Specification
1 聽Insulation thickness 聽100-150um
2 聽Break-down voltage 聽AC 3.5 OR 6.0KV
3 聽Withstand voltage 聽DC 3.0 OR 4.0KV
4 聽Flammability 聽t1: 0, t2: 0
5 聽Glass Transition Temperature 聽130 鈩
6 聽Dielectric Constant 聽1MHZ: 5.2
7 聽Thermal Stress 聽288鈩>120S
8 聽Heat Resistance 聽0.6-0.8鈩/W
9 聽CTI 聽>600V
10 聽Thermal Conductivity 聽1.3, 1.6, 2.0, 3.2W/m.k

 

鈾 All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please contact us.

2. Lead time

Samples: Within 24 hours with expedite cost
Mass production: Short delivery time according to different pcb order.

3. Payment Terms:

T/T, WEST UNION, Paypal Accepted
4. View of DiHe Factory


5. Our Advantage:

***Free samples available

***Prompt response
prompt response for RFQs and order status checking.

***Reliable Quality
Complying with IPC class 2 standards. 100% electrical tested.

***Attractive Price
Minimize costs during production and charge low from customers.

***On time Delivery
On time delivery rate is over 97%

***Quick Lead time
2-6 days for one layer, 3-9days for 2 layers, 4-13days for 4 layers, 5-16 days for 6 layers.

***Various Solution
Whatever kind of PCB you鈥檙e looking for, we can find a satisfactory solution for you.

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