



3.0mm black copper core circuit board
single layer copper core聽circuit board
- Description
- Inquiry
Quick Details
Place of Origin: Guangdong, China (Mainland)
Brand Name: ShenZhen DiHe
Model Number:SZDH-MCPCB-006
Base Material:聽copper core
Copper Thickness: 1oz
Board Thickness: 3.0mm
Min. Hole Size: 1.0mm
Surface Finishing:聽OSP
Wrap and twist:: 鈮0.75%
Standard:: IPC-A-6012
Service type: printed circuit board manufacturing
Packaging & Delivery
Packaging Details: vacuum package with high quality carton box
Delivery Detail: 5-7days
Specifications
- Competitive Price, fast reply for RFQ
- UL, ISO9001, ISO14001, IATF 16949, ROHS Certificated (Please go to “About Us” section see the certificate.)
- High Quality, 100% E-Testing OR Flying Probe Testing (100% Function Test Service )
Welcome To ShenZhen DiHe
ShenZhen DiHe, your best option for pcb manufacturing, components source and one-stop pcb assembly.
Product Description
- Printed Circuit Board Manufacturing Capability:
Item | Manufacturing聽Capability | |
聽Mass production | Sample | |
Max.聽Dimension | 1聽Layer: 2000*1200MM(78.7*47.2″)
2 Layers: 2000*900MM(78.7*35.4″) 4-16 Layers: 1650*750MM(64.9*29.5″) |
|
聽Copper Thickness of Inner Layer | 1/2~5oz | 1/2~6oz |
聽Copper Thickness of Outer聽Layer | 1/3~8oz | 1/3~10oz |
聽Min. Annular Ring | 3mil | 2mil |
聽Min. Solder Mask Bridge | 3mil | 2mil |
聽Min. Solder Mask Clearance | 1.5mil | 1mil |
聽Impedance Tolerance | +/-10% | +/-8% |
聽Finished Board Thickness | 0.25mm-3.5mm | 0.2mm-4.0mm |
聽Outline Precision | +/-0.1mm | +/-0.05mm |
聽Surface Finished Type | HASL(LF),聽Flash gold,聽ENIG,聽OSP(Lead free compatible),聽Carbon ink,聽Peelable S/M,聽Immersion Ag/Tin,聽Gold finger plating,聽ENIG+ Gold finger plating,聽Immersion Ag+ Gold finger plating | 聽HASL(LF),聽Flash gold,聽ENIG,聽OSP(Lead free compatible),聽Carbon ink,聽Peelable S/M,聽Immersion Ag/Tin,聽Gold finger plating,聽ENIG+ Gold finger plating,聽Immersion Ag/Tin+Gold finger plating,聽ENIG+OSP |
Production Type | High Precision Multi-layer Circuit Board,聽Blind Vias Board,聽Buried Vias Board,聽High Frequency Board,聽Aluminum Backed Board, High Speed PCB, Embedded Capacitance PCB, Halogen-Free Circuit Board, High-Conductivity Aluminum-Based, Copper-Based and Metal-Mixed PCB, Ceramic Based Circuit Board, Ultra-Thin BT board, Thick Copper Circuit Board, Thick Gold PCB, HDI, FPC, Rigid-Flex PCB, Teflon (PTFE), High-Frequency Mixing Plates聽Circuit Board |
High Precision Multi-layer Circuit Board,聽Blind Vias Board,聽Buried Vias Board,聽High Frequency Board,聽Aluminum Backed Board, High Speed PCB, Embedded Capacitance PCB, Halogen-Free Circuit Board, High-Conductivity Aluminum-Based, Copper-Based and Metal-Mixed PCB, Ceramic Based Circuit Board, Ultra-Thin BT board, Thick Copper Circuit Board, Thick Gold PCB, HDI, FPC, Rigid-Flex PCB, Teflon (PTFE), High-Frequency Mixing Plates聽Circuit Board |
聽Base Material | FR-4,聽Aluminum/Cu聽base board,聽Halogen-free聽,聽High TG,聽High CTI, High Thermal Conductivity,聽CEM-1,聽CEM-3,聽Rogers,聽Teflon,聽聽Nelco,聽Arlon,聽Taconic,
PANASONIC MEGTRON 6 聽 |
FR-4,聽Aluminum/Cu聽base board,聽Halogen-free,聽High TG,聽High CTI,聽High Thermal Conductivity,聽CEM-1,聽聽CEM-3,聽Copper Base,聽Ceramic Base,聽聽Rogers,聽Teflon,聽聽Nelco,聽聽Arlon,聽Taconic,聽PANASONIC MEGTRON 6 |
聽Layers | 聽1-24聽layer | 聽1-40 layers |
聽Inner Layer Circuit(W/S) | 3/3mil | 2/2mil |
聽Outer Layer(W/S) | 3/3mil | 2/2mil |
聽Inner Layer Loard Lhickness | 0.1-2.0mm | 0.075mm-2.0mm |
聽Min.聽Drill Bit Hole Size | 0.2mm | 0.2mm |
Min. Laser Vias Size | 0.1mm | 0.1mm |
聽Hole Plating Aspect Ratio (Max) | 8锛1 | 12锛1 |
No. | 聽Item | 聽Alu Material Specification |
1 | 聽Insulation thickness | 聽100-150um |
2 | 聽Break-down voltage | 聽AC 3.5 OR 6.0KV |
3 | 聽Withstand voltage | 聽DC 3.0 OR 4.0KV |
4 | 聽Flammability | 聽t1: 0, t2: 0 |
5 | 聽Glass Transition Temperature | 聽130 鈩 |
6 | 聽Dielectric Constant | 聽1MHZ: 5.2 |
7 | 聽Thermal Stress | 聽288鈩>120S |
8 | 聽Heat Resistance | 聽0.6-0.8鈩/W |
9 | 聽CTI | 聽>600V |
10 | 聽Thermal Conductivity | 聽1.3, 1.6, 2.0, 3.2W/m.k |
鈾 All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please contact us.
2. Lead time
Samples: Within 24 hours with expedite cost
Mass production: Short delivery time according to different pcb order.
3. Payment Terms:
T/T, WEST UNION, Paypal Accepted
4. View of DiHe Factory
***Free samples available
***Prompt response
prompt response for RFQs and order status checking.
***Reliable Quality
Complying with IPC class 2 standards. 100% electrical tested.
***Attractive Price
Minimize costs during production and charge low from customers.
***On time Delivery
On time delivery rate is over 97%
***Quick Lead time
2-6 days for one layer, 3-9days for 2 layers, 4-13days for 4 layers, 5-16 days for 6 layers.
***Various Solution
Whatever kind of PCB you鈥檙e looking for, we can find a satisfactory solution for you.
Related Products
-
Read MoreQuick View
countersink power pcb
SZDH-MCPCB-007
single layer aluminum core countersink power pcb
-
Read MoreQuick View
round led pcb board fabrication and assembly
SZDH-MCPCB-004
round led pcb for led lamp with high power
-
Read MoreQuick View
single layer CEM-1 pcb manufacturing
SZDH-Single Layer PCB-002
one layer pcb+OSP
CEM-1 pcb
Green solder mask
-
Read MoreQuick View
countersink aluminum pcb
SZDH-MCPCB-008
aluminum core countersink power pcb
-
Read MoreQuick View
2 layers immersion gold power led aluminum pcb
SZDH-MCPCB-011
2聽layers ENIG聽aluminum mcpcb
-
Read MoreQuick View
Green solder mask aluminum base printed circuit board
SZDH-MCPCB-005
single layer aluminum core printed circuit board
-
Read MoreQuick View
3 layers immersion gold mcpcb manufacturing for high power led
SZDH-MCPCB-001
3 layers immersion gold aluminum mcpcb
-
Read MoreQuick View
metal core pcb manufacturing with balck matte solder mask
SZDH-MCPCB-002
high thermal conductivity aluminum pcb(copper core pcb)
-
Read MoreQuick View
Single Layer CEM-1 Printed Circuit Board Production
SZDH-Single Layer PCB-001
one layer pcb+OSP
CEM-1 pcb
black聽solder mask
-
Read MoreQuick View
pcb board manufacturing factory
SZDH-MCPCB-003
pcb board factory with UL,ISO