DiHe Rigid PCB Manufacturing Capability
Item |
Manufacturing Capability |
|
Mass production | Sample | |
Layers |
1-48 layers |
|
Max. Dimension |
1 Layer: 2000*1200MM(78.7*47.2″) 2 Layers: 2000*900MM(78.7*35.4″) 4-16 Layers: 1650*750MM(64.9*29.5″) |
|
Min. Dimension |
2*2mm |
|
Finished Board Thickness |
0.075mm-14mm |
|
Copper Thickness of Inner Layer |
1/2~12oz |
|
Copper Thickness of Outer Layer |
1/3~28oz |
|
Inner Layer Circuit(W/S) |
3/3mil |
2/2mil |
Outer Layer(W/S) |
3/3mil |
2/2mil |
Min. Annular Ring |
3mil |
2mil |
Min. Solder Mask Bridge |
3mil |
2mil |
Min. Solder Mask Clearance |
1.5mil |
1mil |
Impedance Tolerance |
+/-10% |
+/-8% |
Outline Precision |
+/-0.1mm |
+/-0.05mm |
Surface Finished Type |
HASL(LF), Flash gold, ENIG, OSP(Lead free compatible), Carbon ink, Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger plating, Immersion Ag+ Gold finger plating |
HASL(LF), Flash gold, ENIG, OSP(Lead free compatible), Carbon ink, Peelable S/M, Immersion Ag/Tin, Gold finger plating, ENIG+ Gold finger plating, Immersion Ag/Tin+Gold finger plating, ENIG+OSP |
Production Type |
High Precision Multi-layer Circuit Board, Blind Vias Board, Buried Vias Board, High Frequency Board, Aluminum Backed Board, High Speed PCB, Embedded Capacitance PCB, Halogen-Free Circuit Board, High-Conductivity Aluminum-Based, Copper-Based and Metal-Mixed PCB, |
High Precision Multi-layer Circuit Board, Blind Vias Board, Buried Vias Board, High Frequency Board, Aluminum Backed Board, High Speed PCB, Embedded Capacitance PCB, Halogen-Free Circuit Board, High-Conductivity Aluminum-Based, Copper-Based and Metal-Mixed PCB, |
Base Material |
FR-4, Aluminum/Cu base board, Halogen-free , High TG, High CTI, High Thermal Conductivity, CEM-1, CEM-3, Rogers, Teflon, Nelco, Arlon, Taconic, PANASONIC MEGTRON 6
|
FR-4, Aluminum/Cu base board, Halogen-free, High TG, High CTI, High Thermal Conductivity, CEM-1, CEM-3, Copper Base, Ceramic Base, Rogers, Teflon, Nelco, Arlon, Taconic, PANASONIC MEGTRON 6 |
Min. Drill Bit Hole Size |
0.2mm |
0.2mm |
Min. Laser Vias Size |
0.1mm |
0.1mm |
Hole Plating Aspect Ratio (Max) |
8:1 |
12:1 |